- Advanced Interconnect Technologies
- 2.5 & 3D Heterogeneous Integration
- System in Package (SiP)
- Wafer Bumping & WLP
- Multi-Chip Modules (MCMs)
- Novel Microfabrication & MEMS
- Design, Packaging & Assembly
- Assembly Services
- Final Test
- Chip on Board (CoB)
- Plastic Packaging (BGA/CSP/QFN)
- Hermetic Packaging
- MIL-STD-1553 Data Bus Couplers & Accessories
- Micro In-Line Couplers
- Tab Mounted In-Line Couplers
- Through Hole Mounted In-Line Couplers
- Box Couplers
- Custom Design Couplers
- Data Bus Coupling Transformers
- Data Bus Relays
- Data Bus Harnesses
- Bus and Stub Terminators
- Wide Bandwidth RF & Video Transformers
- Antenna Couplers
- Video Isolation Transformers
- RF Wideband Transformers
- RF Wideband Transformers & Impedance Adapters
Micross utilizes environmental chambers to accelerate deterioration and shorten test cycles by varying temperature and pressure. Our environmental testing capabilities include high and low temperature operating limits (HTOL/LTOL), highly accelerated stress test (HAST), high temperature storage life (HTSL), temperature humidity bias (THB) and many others.
Micross STS provides advanced assembly, test and qualification services and serves as one of the premier laboratories of choice within San Jose.
Flyer - Micross Environmental TestingComponent Qualification
Employing state-of-the-art test equipment to provide reliability solutions for ICs, material analysis, latest ESD/LU equipment, acoustic image
More infoBoard Level Qualification
Reliability tests, level I & level II qualification, qualification regime, customized reliability tests, failure analysis, customized screening capability
More infoESD Characterization
Capability to test at 2304 pins per device and capacity, added capacity expansion, vector generator, specialty EOS testing
More info